![]() Advanced Thermal Solution with NanoCarbon Fins-Array III Heatsink, Direct-Touch Heatpipe II and NanoCarbon Baseplate.DDR5 XTREME MEMORY Design with SMD DIMM and Shielded Memory Routing.Direct 19+1+2 Phases VRM Design with 105A Power Stage* and Tantalum Polymer Capacitor. ![]()
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |